Item		Sheet-type Thermal GEL COH Series					Remark
		COH-1002	COH-2003	COH-4000	COH-4000LVC	COH-6000LVC
Thermal conductivity (W/m · K)	Our tests	1.8	3.5	6.5	6.5	1.8	Taica.std.
	Hot Wire Method*1	1.0	1.4	2.1	2.1	1.0	JIS R 2616
Appearance		White	Orange	Gray	Gray	Blue	-
Specific gravity		1.7	2.1	2.8	2.9	1.7	JIS K 6249
Hardness(Shore 00)		30	48	57	55	16	ASTM D2240
Specific volume resistance ratio (Ω · cm)		7.7×1013	1.0×1012	5.7×1012	7.09×1012	8.70×1013	JIS K 6249
Tensile strength(Mpa)		0.17	0.23	0.12	0.35	0.15	JIS K 6249
Elongation(%)		164	115	220	68	350	JIS K 6249
Compression set(%)		69	78	92	72	49	JIS K 6249
Dielectric constant	〈50Hz〉	7.3	6.1	8.6	5.6	5.2	JIS K 6249
	〈1kHz〉	4.8	5.2	7.6	5.0	3.7	JIS K 6249
	〈1MHz〉	3.9	4.5	7.4	5.5	3.4	JIS K 6249
Dielectric dissipation factor	〈50Hz〉	0.290	0.106	0.198	0.006	0.115	JIS K 6249
	〈1kHz〉	0.153	0.067	0.082	0.002	0.057	JIS K 6249
	〈1MHz〉	0.013	0.017	0.054	0.0004	0.0050	JIS K 6249
Dielectric breakdown voltage(kV/mm)		18.0	15.7	7.2	12.5	12.5	JIS K 6249
Low molecular weight siloxane level ΣD4 - 10(ppm)	Solvent extraction method	Less than 600	Less than 700	Less than 300	Less than 13	Less than 60	Solvent extraction method
	Head space Method*2	Less than 5	Less than 1	Less than 1	-	Less than 1	-
Flame retardance		V-1（0.5mmt） V-0（1.0-3.0mmt）	V-0（0.5-3.0mmt）	V-0（0.5-3.0mmt）	V-0（0.5-3.0mmt）	V-1（0.5mmt） V-0（1.0-5.0mmt）	UL94
RoHS controlled substances*3		Not detected	Not detected	Not detected	Not detected	Not detected	-
Temperature range(℃)*4		-40 ~ +150	-40 ~ +120	-40 ~ +200	-40 ~ +150	-40 ~ +150	-

*1 *2 *3 *4

Hot Wire Method : Using the QTM - 500 Quick Thermal Conductivity Meter, from Kyoto Electronics Manufacturing Co., LTD. Head Space Method : at 70℃. RoHS controlled substances : Assayed by SGS Far East Ltd. Temperature range : These temperature ranges are not the guaranteed values by Taica Corporation. The applicability should be determined respectively through the tests under actual conditions of each usage.

Computer internals (CPU,motherboard,etd.) Power transistors, Power supply equipment. Electronic parts,such as semiconductors,that produce heat.

· Slowly peel off one side of the protective film of .
· Carefully place the sheet on the heat source or heat sink without trapping air.

·	Peel the remaining layer from with no air trapped in between the sheet and heat dissipating device or heat generating device.

Sheet size 400mm×400mm (Standard size) Sheet thickness 0.5 , 1.0 , 2.0 , 3.0mm (Up to 5mm in 300 x 300mm for COH-6000LVC)

1. · Silicone oil may bleed under certain usage condition.
2. · Low molecular siloxane is included in this product basically composed of silicone.
   
   To the best of our knowledge , the information and statements on this literature are believed to be true and reliable ;however, the PRODUCTS described herein are sold WITHOUT ANY GUARANTEE OR WARRANTY INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR PARTICULAR PURPOSES since the application and conditions of each use vary and change, and are beyond the control of manufacture and seller(s).The customers and users of the PRODUCTS shall assume the responsibility for determining the suitability of the PRODUCTS based on their tests and for whatever risks and liability associated with the use of the PRODUCTS. NEITHER MANUFACTURER OR SELLER(S) SHALL BE LIABLE EITHER IN TORT OR CONTRACT OR ANY OTHER CAUSE FOR ANY KIND OF LOSS OF PROFITS OR DAMAGE , INCIDENTAL, DIRECT, OR CONSEQUENTIAL ARISING OUT OF OR IN CONNECTION WITH THE USE OF OR THE INABILITY TO USE THE PRODUCTS.

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