| Item | Paste-type Thermal GEL DP Series | EMI absorbent + Thermal Conductive GEL |
Remark | |||
| DP-100 | DP-200 | DP-300 | REP-100 | |||
| Thermal conductivity (W/m · K) |
Our tests | 6.5 | 4.8 | 4.8 | 1.0 | Taica std. |
|---|---|---|---|---|---|---|
| Hot Wire
Method*1 |
2.1 | 1.6 | 1.6 | 0.6 | JIS R 2616 | |
| Appearance | Gray paste | Gray paste | White paste | Black | - | |
| Specific gravity | 2.8 | 2.6 | 2.7 | 2.9 | JIS K 6249 | |
| Hardness (Cone penetration · 1/10mm not mixed) |
51 | 55 | 60 | 60 | JIS K 6249 （1/4 cone） |
|
| Specific volume resistance ratio (Ω · cm) |
5.9×1013 | 7.2×1014 | 1.4×1014 | 2.0×1012 | JIS K 6249 | |
| Dielectric constant |
〈50Hz〉 | 8.9 | 7.6 | 4.4 | - | JIS K 6249 |
| 〈1kHz〉 | 7.8 | 6.7 | 4.2 | - | JIS K 6249 | |
| 〈1MHz〉 | 7.0 | 6.6 | 4.0 | - | JIS K 6249 | |
| Dielectric dissipation factor |
〈50Hz〉 | 0.234 | 0.017 | 0.005 | - | JIS K 6249 |
| 〈1kHz〉 | 0.061 | 0.007 | 0.004 | - | JIS K 6249 | |
| 〈1MHz〉 | 0.015 | 0.005 | 0.0004 | - | JIS K 6249 | |
| Dielectric breakdown voltage (kV/mm) |
5.0 | 5.6 | 9.6 | 4.0 | JIS K 6249 | |
| Low molecular weight siloxane level ΣD4 - 10(ppm) |
Solvent extraction method |
less than 700 |
less than 900 |
less than 300 |
less than 300 |
- |
| Head space Method*2 |
less than 1 |
less than 3 |
less than 1 |
less than 1 |
- | |
| RoHS controlled substances*3 |
Not detected | Not detected | Not detected | Not detected | - | |
| Temperature range(℃)*4 | -40 ~ +200 | -40 ~ +150 | -40 ~ +120 | -40 ~ +150 | - | |
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Bottle | Bottle | |||
| *1 *2 *3 *4 |
Hot Wire Method : Using the QTM - 500 Quick Thermal Conductivity Meter, from Kyoto Electronics Manufacturing Co., LTD. Head Space Method : at 70℃. RoHS controlled substances : Assayed by SGS Far East Ltd. Temperature range : These temperature ranges are not the guaranteed values by Taica Corporation. The applicability should be determined respectively through the tests under actual conditions of each usage. |
Gaps around heat sources such as high performance semiconductors.
The surface, underside, and lead lines of heat sources such as ICs.
Sources of heat where it is difficult to fix sheet-type Thermal GEL.
Where there is insufficient room for thermal conductive material.
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*Other package is also available. |
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- · Silicone oil may bleed under certain usage condition.
- · Low molecular siloxane is included in this product basically composed of silicone.
To the best of our knowledge , the information and statements on this literature are believed to be true and reliable ;however, the PRODUCTS described herein are sold WITHOUT ANY GUARANTEE OR WARRANTY INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR PARTICULAR PURPOSES since the application and conditions of each use vary and change, and are beyond the control of manufacture and seller(s).The customers and users of the PRODUCTS shall assume the responsibility for determining the suitability of the PRODUCTS based on their tests and for whatever risks and liability associated with the use of the PRODUCTS. NEITHER MANUFACTURER OR SELLER(S) SHALL BE LIABLE EITHER IN TORT OR CONTRACT OR ANY OTHER CAUSE FOR ANY KIND OF LOSS OF PROFITS OR DAMAGE , INCIDENTAL, DIRECT, OR CONSEQUENTIAL ARISING OUT OF OR IN CONNECTION WITH THE USE OF OR THE INABILITY TO USE THE PRODUCTS.
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